Texas Instruments Incorporated Dallas , TX 75201
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. We're committed to building a better future from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us change the world, love your job!
About the job:
Analog and Embedded Processing are key growth areas for TI. As a member of our packaging team, you'll have the chance to interact with many product groups, internal and external factories, and customers around the world. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Analog and EP organizations.
Driving next generation bump and WCSP technologies for improved performance, cost reduction and reliability. Lead process development within sputter, plate, etch, thin-films and photolithography. Further material roadmaps in copper plating, polymer films, liquid/dry film resists, and ball place. Some clean room time will be required to develop new processes for the next gen technologies.
Working with internal and external customers on key issues resolution root cause analysis
Engaging with multiple internal and external stakeholders to guide and execute on technology roadmaps to support future products
Managing multiple projects and impromptu needs simultaneously, interacting with other groups, and developing relationships with remote sites and organizations
Working with individuals and teams across broad geographical and organizational boundaries
Support of business, customer, manufacturing and quality partners
Peer training and mentoring.
BS in Mechanical, Electrical, or Chemical Engineering or Material Sciences
5+ years' experience in bump manufacturing
Knowledge of bump fab materials (sputter, electroplating, photoresists, ball place, AVI) and integration.
Understanding of basic WCSP design and bump processing including FMEA's and the relationship between bump and package.
Multi-functional team leadership, multi-site project management
WCSP Design, for Manufacturing, Reliability, and Performance.
Experience working with customers on root cause finding and key issues resolution.
Experience engaging with multiple internal and external stakeholders to guide and execute on technology roadmaps to support future products
Experience working with individuals and teams across broad geographical and organizational boundaries
Experience supporting business, customer, manufacturing and quality partners
Experience with peer mentorship and training to include junior and senior engineers
Knowledge of both wet and fry film resist preferable.
Track record of development work leading to volume production for bump processing.
Excellent cross functional project management, management, and presentation skills
Experience managing multiple projects and impromptu needs simultaneously, interaction with other groups, developing relationships with remote sites and organizations
Accountability, responsiveness, ability to lead cross-functional teams to effective solutions, knowledge sharing.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity, or age.