MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
MACOM is an Equal Opportunity Employer.
We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.
Wafer & Hybrid Assembly Process Engineer
This role will be part of a technical team responsible for assigned activities that encompass new product introduction and sustaining technical efforts for the Die Business as well as Hybrid Assembly. As part of the technical support team, this role helps process completed semiconductor wafers into individual die for direct customer sales as well higher levels of assembly and integration. GaAs, InP, Si, GaN and other compound semiconductor wafers require manufacturing process support ranging from:
Automated wafer singulation
Automated and semiautomated die pick and place
Automated optical inspection programming
Manual and automated die attach
Manual and automated wire and ribbon bonding
This engineer will support areas and processes as assigned. The scope of support entails:
Maintaining, documenting and adjusting existing processes, procedures and equipment to ensure SPC compliance and quality control. Ability to trouble-shoot processes and analyze data.
Providing timely feedback to foundry engineers on process variations and defective wafers to help drive yield improvement. Interface with engineers and suppliers to determine the necessary changes to modify and enhance manufacturability of products.
Leading continuous process and procedure improvement efforts to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety.
Ensuring new product introduction designs are producible, sufficiently documented and manufacturing ready (including tooling, software and new processes). Generate ECOs to correct and improve assembly documentation. Participate in Preliminary Design Reviews, Critical Design Reviews, and Manufacturing Readiness Reviews. Share process and idea concepts during design and prototype phases.
Developing new process capabilities as required. Perform detailed Design of Experiments (DOE) and analyze results using statistical methodology. Develop fixture design concepts to support new and existing processes.
Ensuring equipment is safe, ESD grounded and properly maintained on a regular preventative maintenance schedule to minimize down time. Developing periodic maintenance procedures and process controls.
Leading efforts to diagnose problems and implement corrective actions.
Helping to train production operators on new equipment and processes. Ensure that ESD practices are followed.
Maximizing production through-put while maintaining product integrity. Help build and maintain capacity modeling for specific processes and equipment
Supporting product transfers
The successful candidate will be an effective communicator, problem solver, proactive process owner and insightful engineer. They will collaborate and share their knowledge with other engineers to help develop the organization and their peers.
BS or MS degree in Engineering.
Knowledge of wafer, microelectronic and hybrid assembly processes and manufacturing equipment including wafer singulation, wafer cleaning and automated wafer pick and place.
Strong understanding of SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving. Capable of working in a networked environment using MS Office Suite products, CAD, Agile and ERP systems like SAP.
Proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
Display a strong sense of drive and dedication to continuous improvement.
Willingness and enthusiasm to take on aggressive goals and a commitment to achieve them.
Possess the ability to work collaboratively with cross functional teams to improve processes. High energy, self-motivated, positive attitude with strong communication skills and an ability to interface effectively with different backgrounds and at every level of the organization
Excellent written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
Detail-oriented with strong organizational skills.
Due to ITAR restrictions, must be US citizen or Permanent Resident.
Experience with ISO9001, AS9100, Mil-STD-883 and MIL-PRF-38534.