MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
MACOM is an Equal Opportunity Employer.
We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.
Wafer Fab Process Engineer - Principal
Process Engineer responsible for developing new processes and sustaining existing processes in the wafer fab located in Ann Arbor Michigan. Products include high speed InP based PIN photodiodes and Avalanche Photodiodes (APDs)
Specific responsibilities include: developing new processes for new products, developing new process capabilities for existing products and sustaining and continuous improvement activities. Sustaining and continuous improvement activities include, but are not limited to: quality, reliability, cost, yield, process stability/capability, productivity, and safety. The processes utilized in the wafer fab include, but are not limited to photolithography, metallization, wet etching, RIE etching, PECVD, nitride and oxide deposition, atomic layer deposition, lapping and polishing.
BS, M.S. or PhD. in Engineering or Materials Science with +5 years of experience in process development in a wafer fab environment.
Demonstrated knowledge in compound semiconductor processes for high frequency applications.
Familiarity with typical materials systems for compound semiconductor devices.
Strong understanding of semiconductor device physics and device processing, data mining and statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving.
Must have a proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
Must display a strong sense of ownership, drive and dedication to continuous improvement.
Must display an enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.
Must possess the ability to work collaboratively with cross-functional teams to improve processes.
Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
Detail-oriented with strong organizational skills.