Wafer Assembly Plating Module Engineer

Job Description

As wafer level assembly technology development (WATD)Plating Module Engineer, you are responsible for driving plating process technology development to enable best plating process to meet program needs. You will design, execute and analyze experiments to improve process efficiencies.

You will engage closely with equipment suppliers to identify the hardware modification for better process outcome. You will develop new chemicals and processes to meet program needs. You will develop plating processes that sustainable for high manufacturing volumes, to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly methodology.

You will be responsible to install and qualify manufacturing capacity at the development site and audit installation/qualification and supervise first full loop at the production site. You will develop and sustain plating process in semiconductor fab manufacturing operations.

Qualifications

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