Sr./Principal Microelectronics Process/ Packaging Engineer

Delivering mission-critical, electronic solutions that protect lives. Use your creativity and critical thinking to take our products from concept to customer.

At CAES, we engineer solutions for the world's most critical missions. We serve customers in the defense and aerospace markets. Seeking a career that offers challenging, diverse projects and opportunities?

Looking for a position with a company that offers long-term professional advancement? Searching for a place that values a diverse, team-based environment? One that values YOU.

Consider CAES. The most important thing we build is TRUST Overview Seeking a Senior/Principal level Microelectronic Process/ Packaging Engineer for either our Richardson, TX or Forsythe, MO location! This role reports the MMIC Design Center organization under CAES Defense Systems.

The MMIC Design Center is comprised of a team of 20+ MMIC and Packaging Designers creating advanced RF solutions for internal and external customers. The Center has PMO, test and test support engineering to convert designs into delivered products as well as systems expertise to support customer architectures and trade studies also enabling CAES capabilities at board and sub-array levels. Consider joining us!

Apply today. The ideal candidate is someone with a strong technical engineering, materials and analytical background who has experience designing, developing, implementing and qualifying advanced microelectronics package and assembly technology, and who has proven capabilities to work across functions in a matrix organization to achieve operational results. Responsibilities Identify, design, develop and qualify microelectronic packages in support of new product development roadmaps.

Interface with internal and external customers to understand, define and document IC package requirements in accordance with the product specifications (Mil-Aero, Space, Commercial). Select appropriate material sets, perform CAD modeling, and work with packaging vendors to design IC Packages to meet quality and reliability targets for the product. Utilize CAD design and simulation tools to perform Thermal and Mechanical modeling, as well as design of assembly fixtures and hardware. Prepare mechanical drawings and documentation relating the package development to includes procedures, procurement, training and maintenance specifications.

Provide technical inputs and guidance on recommended package and assembly technology. Perform cost effective continuous improvement efforts to improve manufacturability, quality and reliability of products. Utilize Microsoft Office suite to create schedules, track progress and cost, and publish reports in support of program management and reporting.

Maintain a thorough understanding of manufacturing equipment in order to support the development of cost effective and efficient manufacturing processes. Conduct and/or support Failure Analysis efforts to determine root cause and implement effective corrective action to address manufacturing issues. Work collaboratively with manufacturing engineering to assure that design-for-manufacturing and design-for-reliability principles are applied.

Provide accurate and timely risk and opportunity assessments, decision making, and root cause corrective actions (RCCAs). Coordinate document and drawing releases with the engineering, design, and material planning functions. In coordination with the lead engineer and supply chain, contribute to appropriate vendor selection decisions and vendor development activities. Perform other related duties as assigned.

Core Competencies: Knowledge of legacy and advanced microelectronic package technologies, materials, manufacturing, plating, flip chip, and wire bond assembly. Experience in modeling thermal-mechanical stress analysis using FEM modeling tools (CTE mis-match, solder stress, reliability, etc.). Experience with microelectronic package assembly processes, including, but not limited to, wafer bumping, wafer grind, dice and pick, die attach, wire bond, flip chip, epoxy dispense, solder print, and mass reflow.

Experience with different types of assembly materials, including conductive and non-conductive epoxies, underfills, and different types of solder alloys. Experience with package assembly subcontractors. Ability to define and execute development tasks and activities in support of overall product or technology development programs.

Ability to lead and drive high performance across engineering programs, with a strong focus on program execution and rigor, customer satisfaction. Ability to apply sound technical and engineering judgment, making impactful decisions in complex and ambiguous situations, often with incomplete data, reaching out to Subject Matter Experts when necessary. Strong written and verbal communication skills.

Demonstrated ability to analyze data, create reports, and present findings to panels, groups, teams, or departments as required. Good engineering work practice/ethic, self-motivated, and reliable. Demonstrated ability to deliver on-time and work well with multi-discipline team members and organizations.

Ability to effectively interact and communicate with CAES senior management, as well as internal and external customer. Qualifications Minimum: Bachelors degree in Mechanical Engineering, Materials Engineering, or Physics.

Five (5)+ years of experience in microelectronics assembly and package experience including: Microelectronics semiconductor package technology design and manufacture, with strong technical expertise. Defining and executing development and qualification activities and tasks.

Familiarity with CAD software tools such as Solid Works and ANSYS Mechanical for 3D modeling and finite element analysis. This position requires access to technology, materials, software or hardware that is controlled by US export laws. In order to be eligible for this position, you must be a "US Person" under US export laws (or eligible for approval under a U.S.

Government export license). Ability to obtain and maintain a security clearance. Preferred: Advanced Engineering or Physics Degree. Eight (8)+ years of experience in microelectronics assembly and packaging Ability to effectively communicate across functions, to management, and to customers.

Experience with GaAs/GaN semi-conductor materials and processing. IC Packaging of GaAs or GaN semi-conductor MMIC devices. ANSYS HFSS and AWR Analyst for EM simulations.

Experience with Package Qualification per MIL-PRF Requirements. Certification in Lean 6-sigma methods. Salary Range: $84,000 - $138,000 annually (Richardson, TX). Employees may be eligible for a discretionary bonus in addition to base bay.

Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate. CAES provides a variety of benefits including health insurance coverage, life and disability insurance, 401K, paid holidays and vacation. EMPLOYMENT TRANSPARENCY BENEFITS We take care of our people and provide competitive health, wealth and wellbeing benefits - from day one.

You'll also discover learning and development opportunities so you can take your career to the next level - and beyond. Other benefits include: Comprehensive PTO, Paid Holiday and Paid Family Leave Programs.

Student Loan Repayment Program & Tuition Reimbursement 9/80 Alternate Work Week Schedule Tailored Management/Leadership Training Innovative Medical Programs, Including Family Forming ABOUT CAES CAES is the largest provider of analog and radiation hardened technology for the United States aerospace and defense industry. From human spaceflight and space exploration, to missile defense and electronic warfare, to healthcare solutions addressing COVID-19, our talented team develop high performing electronic solutions that work the first time, every time. WE ARE AN EQUAL OPPORTUNITIES EMPLOYER At CAES we welcome differences and celebrate new ideas.

We believe the diversity of our people inspires our creativity and drives our innovation. Everyone is welcome here, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information. We are committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation due to a disability for any part of the employment process, please email CAEScareers@caes.com.