Apple Inc. Santa Clara , CA 95051
Apple's PPO Sensing Group is looking for a senior level electronic packaging engineer to work on developing exciting new products. Be responsible for providing module packaging solutions in a system for various consumer markets.
You will report directly to the Advanced Packaging Manager, working with internal device design, product design, operation, and supply chain. You will also work with the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a consistent track record to reduce to practice in a high volume manufacturing environment.
In-depth knowledge in the area of optical sensor packaging technologies, including QFN, LGA, and WLCSP. Understand LED and photodiode fabrication and device physics. Understand the mechanism and integration of optical elements such as microlens, Fresnel, diffuser and Light Conducting Film.
Hands-on assembly experience of optical package with high accuracy placement, optical enhancement and isolation is a must.
Must be familiar with optical grade packaging materials, LCP, PPA, and high performance polyamide, their optical and mechanical properties, and reliability implications.- Expert level knowledge in backgrind, dicing, die attach, multi-die stacking, wirebond, flip chip, encapsulation, singulation and wafer level packaging processes.
Familiar with assembly substrate design rules and module design rules, and be smart about challenging the design rules and advance the design rules. Know how to identify risks and mitigate the risk.
Knowledge of WLFO, 3DIC/TSV, RDL and UBM is a plus.- Good written and verbal communication skills. You will have to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings. You will need to be able to conduct independent research and development under minimal supervision.- Consistent track record to bring up a product from conceptual stage to MP stage.
Define new package special characteristics based on unique system level performance, cost, and footprint requirements. Own package design function including conceptual and layout approval.Define and develop a MP assembly process.
This includes, but not limited to, the initial proof of concept demo work, novel process, equipment and materials development work, process control plan, IQC and OQC, yield analysis and enhancement work.Interface and coordinate with other team members to meet product development/ramp schedule. Signoff package checklist, design and process FMEA, and other breakthrough tasks.Define packaging roadmap based on long term packaged product requirements. Lead the supplier's R&D activities.
M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science or similar disciplines.Apple is an Equal Opportunity Employer that is committed to inclusion and diversity. We also take affirmative action to offer employment and advancement opportunities to all applicants, including minorities, women, protected veterans, and individuals with disabilities. Apple will not discriminate or retaliate against applicants who inquire about, disclose, or discuss their compensation or that of other applicants.