Do you love working on challenges that no one has solved yet? Do you like changing the game?
Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. The Metallurgist is responsible for researching and developing lead-free low-melting solder alloys, including formulating different metallurgies with vendors, improvement of mechanical strength, ductility, solder-ability, soldering life reliability testing.
We are looking for someone with 10+ years of industry experience in electronic packaging, solder joint/interconnect reliability and materials/process integration Experience with alloys and powder metallurgy, IC and package interconnect solder materials experience is highly desirable. Background in failure analysis techniques e.g.
SEM, EDX, FTIR, etc. The ideal individual will have good cross-geographical integration, facilitation and communication skill Familiarity with advanced manufacturing engineering techniques, i.e. Copy Exact, D.O.E., Six Sigma and statistical analysis.
Defining and enabling materials and process solutions for new product introduction. Solder alloy and flux development with materials suppliers as well as solder joint/interconnect characteristic analysis including fatigue, IMC characteristics, electro-migration improvements and enhancements Managing material development roadmap for new products and troubleshoot production manufacturing processes to ensure the material is manufacturable and cost competitive Oversee and work closely with process development engineers to meet quality, cost and timeline Coordinate with multi-functional teams to enable and implement new materials and processes to timely meet project cost and schedule objectives
MS or PhD in Chemical Engineering, Materials Engineering, Mechanical Engineering or Metallurgy