Requisition ID 130280BR Date updated 12/19/2018
The Mechanical Subsystems Directorate (MSD) is searching for an Electronics Packaging Specialist to work in our Huntsville, AL location. In this position, the candidate will be responsible for developing technical solutions to a wide range of complex problems related to the entire product life cycle including proposal, design, manufacture, integration and test of electronics and interconnect packaging solutions for multiple missile programs.
Under general supervision, the candidate will be required to define mechanical outline and construction details, connector selection and specification, mechanical and assembly drawings, oversee electrical layout and be responsible for final technical data package. Familiarity CREO and drawing standards is recommended. The candidate will also be responsible for meeting cost, schedule, quality, and performance requirements for the finished product.
The candidate will work with minimal direction or supervision while exercising considerable latitude in determining the technical objectives of the assignment. The position will require frequent interaction with senior external personnel on significant technical matters often requiring coordination between organizations. Periodic travel will be required to CCA, interconnect, machining, and flex circuit manufacturing facilities. International travel may also be required.
Note: This position can be a Salary Grade G09 (Sr. Mechanical Engineer II) or a Salary Grade G10 (Principal Mechanical Engineer) based on the candidate's qualifications as they relate to the skills, experience and responsibility requirements for the position.
A minimum of six (6) years of experience in the design and manufacturing of electronics packaging for military and aerospace applications
Must possess a thorough knowledge of GD&T, ANSI drawing standards and first order analysis techniques.
Must have a working knowledge of Microsoft Office (Word, Excel, PowerPoint)
Must currently have or be able to obtain a DoD Secret Clearance
U.S. Citizenship is required
Eight (8) years of experience in the design and test of electronics packaging for military and aerospace applications
Familiarity with CREO, ANSYS
Cognizant of machine suppliers' capabilities or have direct experience in a manufacturing and assembly support role
Strong technical background with high technical aptitude
Strong leadership skills
Very strong verbal and written communications and interpersonal skills when working with team members and customers
Required Education (Including Major):
Bachelor's Degree in Mechanical or Electrical Engineering
This position requires the eligibility to obtain a security clearance. Non-US citizens may not be eligible to obtain a security clearance.
The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. Employment is contingent on other factors, including, but not limited to, background checks and drug screens. http://www.dss.mil/psmo-i/indus_psmo-i_interim.html 130280
Business Unit Profile
Raytheon Missile Systems (RMS) is the world leader in the design, development and production of missile systems for critical requirement including air-to-air, strike, surface Navy air defense, land combat missiles, guided projectiles, exoatmospheric kill vehicles, missile defense and directed energy weapons. RMS is headquartered in Tucson, Arizona with over 11,000 employees operating at sites across the country and internationally.
Type Of Job
AL - Huntsville
Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.