pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor's 30-year legacy of technology advancements and strong IP portfolio but with a new missionto enhance Murata's world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi's product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi's team explores new ways to make electronics for the connected world smaller, thinner, faster and better.
In this role you will be the corporate Subject Matter Expert (SME) for wafer bumping and redistribution Layers (RDL). You will provide corporate level package engineering leadership for new pSemi IC products. This will include elements of new product development, package design, assembly characterization and qualification, interfacing with off-shore assembly contractors, and sustaining production issues. The assigned tasks will be significant and unique in nature and will require analysis of industry capabilities in packaging and package assembly, in-depth understanding of new product package requirements and intangibles. The candidate will need to exercise independent judgment in methods, techniques and evaluation criteria to achieve results. The person in this role will be responsible for successful release of new packages into production once a design is proven functional. This will require a strong ability to coordinate among different engineering groups. The candidate must enjoy working in a fast-paced environment while maintaining a sense of commitment and be flexible to project needs. The candidate must be a team player and possess a sense of urgency to meet product requirements on schedule.
Roles & Responsibilities
This position has responsibility for:
Provide subject matter expertise in wafer bumping and RDL design, development, implementation and high volume manufacturing oversight.
Advising and directing Product Development functions on bumping, RDL and other packaging options to meet required performance standards.
Inspecting and verifying IC designs for adherence to bump and RDL design rules
Investigating OSAT companies, establishing relationships and coordinating potential manufacturing start up.
Overseeing and leading established OSAT subcontractors in the manufacture of pSemi packaged products. Occasional travel to OSAT facilities will be required.
Owning advanced package solutions from concept to production
Identifying and driving cost reduction projects
Resolving package or assembly process related manufacturing issues with minimum delay
Mentoring junior engineers in all aspects of the packaging and assembly disciplines
Implementing package feasibility studies and package selection efforts for new products
In order to perform the job successfully, an individual should demonstrate the following competencies:
Driving for Results: Aggressively pursues challenging goals and objectives; will put in considerable time and effort to accomplish objectives; takes a highly focused, goal driven approach toward work
Acting Decisively: Moves quickly to make decisions and commit to a clear course of action; comfortable making decisions based on partial information; willing to take risks in order to maintain momentum; shows a strong bias toward action
Acting as a Champion for Change: Challenges the status quo; encourages people to question existing methods, practices, and assumptions; supports people in their efforts to try new things
Critical thinking: Skilled at finding logical flaws in arguments and plans; identifies problems and solutions that others might miss; provides detailed insight and constructive criticism into problems and complex situations
Working with Ambiguity: Achieves forward progress in the face of poorly defined situations and/or unclear goals; able to work effectively with limited or partial information
Minimum Qualifications (Experience and Skills)
Minimum 12 years of experience in related field
Experience with package assembly process development
Understanding the chip design and manufacturing process and it's interaction with packaging and assembly.
Cross-functional team leadership
Experience driving packaging development efforts
Experience working with off-shore assembly suppliers
Understanding of the semiconductor supply chain
Understanding materials properties and interactions
Understanding of RF packaging requirements
Expertise with Cadence and AutoCAD desired
This job operates in a professional office environment. This role routinely uses standard office equipment.
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.
pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver's license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including "protected veterans" under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.
Note: The Peregrine Semiconductor name, Peregrine Semiconductor logo and UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP and DuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: http://patents.psemi.com