Be a part of the engineering team that enables the Connected Digital Lifestyle. We are the package engineering team that drives semiconductor package development from concept to mass production. You are the talented individual who we are looking for to make an impact from Day One.
Work closely with cross functional teams Sales&Marketing, Design Engineering, RQA and Product engineering to develop and provide cost effective, high performance IC packaging solutions.
Manage product based package projects from concept through development, prototype build, qualification, and volume production release.
Engage in package substrate design and perform package substrate layout review using APD.
Manage/drive/support OSAT to provide package design, thermal and electrical simulation and assembly support.
Apply engineering knowledge of assembly/substrate fabrication to develop new packages, run DFX, drive assembly process improvements to improve yield and prevent quality/reliability issues.
Bachelor's or master's degree in Engineering
Minimum 2 years FCBGA package development experience.
Understand the basic process of FCBGA assembly and flipchip substrate fabrication.
Good written and verbal communication skills. Communication experience with Asia OSAT is a plus
Familiar with package substrate layout review using Cadence APD. Package substrate design experience using Cadence APD is a plus
Basic AutoCAD, MS office and computer skills
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.