Microsoft Research has been studying quantum computing for several years and has become the world's center of expertise on topological quantum computing. The research effort includes a staff of theoretical physicists and experimental teams around the world.
The Microsoft Quantum Group is looking for a Senior Engineer in semiconductor packaging and assembly.
Required Experience and Skills
7 years of experience in semiconductor packaging development or manufacturing
Record of success in cross-functional team environment
Detailed understanding of package manufacturing flows
Hands on experience in package manufacturing and/or test environment preferred
Experience in supply chain technical/quality management
Understanding of semiconductor device reliability, with experience in physical failure analysis preferred
Cryo-mechanical experience a plus
Strong presentation and communication skills
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.
Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.
The Senior Engineer in semiconductor packaging and assembly will be responsible for guiding development of these processes for cryogenic applications. Successful candidates will have a deep understanding of a variety of IC package technologies, as well as experience managing qualification and introduction to manufacturing of advanced semiconductor package technology. Candidate should possess specific experience in one or more of the following areas: high performance build-up substrates, flip chip assembly, 2.5D packaging, or automotive and/or military packaging. In addition, experience in physical failure analysis and subcontract supplier management is strongly preferred.