Senior Engineer, Assembly Engineering

Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

ADI At A Glance

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today's innovators stay Ahead of What's Possible.

We are looking for a highly motivated Sr. Packaging Engineer who will drive power module development activities for ADI's new and existing products. This position will be based in San Jose, CA.

Job Description

• Power module development: design, simulate, optimize, and qualify power module products.

• Business Unit (BU) communications: good communication skills are needed to understand the package requirements and to influence package-related design decisions for new product development.

• Assembly subcontractor/OSATs communications: work closely with ADI's oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls and oversea travels are expected.

• Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support.

• Project management: plan and drive for on time delivery of development projects.

• Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.

• Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.

• Package process development: experience in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).

Minimum Qualifications

• Master's degree in Materials Science and Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields. PhD. degree is preferred.

• Strong background in power electronics, electrical engineering, and materials science.

• In-depth knowledge and experience in power module design, optimization, and manufacturing.

• Experienced in inductor design, construction, and material selection.

• Experienced in electrical simulation tools, such as, Ansys Q3D and Ansys Maxwell.

• Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce

• Bureau of Industry and Security and/or the U.S. Department of State

• Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Graduate Job

Required Travel: Yes, 10% of the time

The wage range for a new hire into this position is $103,040 to $141,680.

• Actual wage offered may vary depending on geography, experience, education, training, external market data, internal equity, or other bona fide factors.

• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.