R&D Integration Engineer

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Job Description:

Job Description

We are looking to hire a talented, highly motivated integration engineer to develop new MEMS micro fabrication technologies. As an Integration Engineer with Broadcom's Wireless Semiconductor Division (WSD), you will develop new FBAR (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies to support the wireless filter business. You will join our process development engineering team and work alongside other manufacturing and development engineers to develop and release new technologies for high volume manufacturing.

The role will involve project management of new technology development activities including scoping, technical work, on-time delivery, and formal presentations. The role may also involve hands-on experimental work in the cleanroom and characterization labs (25-75%). You will be expected to understand key FBAR electrical and physical parameters and utilize CAD software such as Cadence and ADS to extend FBAR value propositions for next generation products. The successful candidate will be expected to function in our highly-collaborative and team-oriented environment including cross-functional groups on site and international teams.

Roles and Responsibilities

• Hands-on visual, mechanical, and electrical evaluation of wafers. Validation of material to R&D specifications and manufacturing standards using metrology and physical analysis.

• Develop and execute DOEs. Develop and verify root-cause models and solutions.

• Lead technology development from concept to high-volume manufacturing readiness

• May need to research and evaluate new capabilities from vendors and drive the tool selection process.

• Create functional MEMS process flows while balancing competing engineering concerns such as quality, cost, and time.

• View, understand, and create layout artwork.

• Apply understanding of device physics and radio frequency (RF) technology to propose new processes and devices.

• Monitor technology developments in academia and industry

Qualifications

Technical Experience

• MS in EE, ME, Materials science, or related discipline with a minimum of 6+ years of experience in semiconductor/MEMs processing or equivalent or PhD in EE, ME, Materials science, or related discipline with a minimum of 3+ years of experience in semiconductor/MEMs processing or equivalent

• Industrial experience as an integration or development engineer with hands-on expertise required. Candidates with significant university cleanroom experience may be considered.

• Experience taking a device idea from initial process conception through high volume production release preferred.

• First-hand experience and expertise with at least one unit process area such as film dep, photo, etch, wafer bond, wet processing, etc.

• First-hand experience and expertise with BEOL processing steps such as metallization, plating, RDL, vias, Cu pillars, wafer bonding

• Comfortable spending time in the cleanroom and physical analysis lab designing, executing, and evaluating experiments.

• Knowledge of and practical experience in statistical analysis and SPC methodology.

• Knowledge of semiconductor processing equipment, vendor roadmaps, and previous experience in working with vendors to deliver necessary process capabilities. Understanding and experience with the hardware, software, control methodologies, and limitations of semiconductor processing equipment.

• Experience designing and implementing novel MEMS components such as microresonators, pressure sensors, accelerometers, or other piezoelectric devices preferred

• RF, FBAR, or BAW experience preferred

Project Management

• Proven ability to manage a technology development program to a schedule.

• Ability to identify critical tasks and secure necessary resources.

• Ability to work well in a team environment, guiding the efforts of unit process engineers and technicians.

• Track record of successful interaction with other functional areas of the organization, such as Procurement, Operations, and Equipment Maintenance.

• Excellent communication and leadership skills.

• Experience and capability to lead team to successful resolution of issues.

Personal Attributes

• High level of personal ownership and self-motivation

• Delivery driven. Ability to identify critical tasks and drive prioritization.

• Ability to work well in a team environment. Accept and provide constructive feedback.

• Track record of successful interaction with other functional areas of a manufacturing organization, such as procurement, operations, and equipment maintenance.

• Excellent communication and leadership skills. History of leading team to successful resolution of issues.

• Flexibility to contribute on multiple programs and shifting projects or priorities.

• Desire to work on different technical topics and areas.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $107,000 - $171,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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