Micross Components Research Triangle Park , NC 27709
Posted 2 months ago
Micross Advanced Interconnect Technology (MAIT) is seeking an experienced Sales person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines at its Research Triangle Park, NC facility. This position will serve primarily as an outward facing Sales person identifying and developing opportunities with existing and potential clients in support of the Inside Sales/Business Development Team and with assistance from the Micross Components’ Group Sales Team. Exceptional candidates will have a strong technical background and experience in technical sales in the semiconductor packaging industry with a proven track record of independently seeking out and developing new business opportunities.
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Micross Components