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HP Inc. is the leader in Inkjet Technology. We work to maintain this position while adding new technologies and innovative products to our portfolio. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on printing and imaging technologies as well as pursuing broader alternative technologies and research with an eye toward commercial applications. We are dedicated to providing advanced innovative solutions to our partners and customers.
The MEMS section from the Advanced Technology Platforms & Solutions in Corvallis, Oregon is looking for a Silicon Product Engineering Intern. HP's Advanced Technology and Platform Solutions department is part of an R&D product development team, developing market leading printing solutions. This intern will work closely with printer development engineers, circuit designers, test engineers and process engineers to complete a project (or projects) related to product development.
Develop fundamental understanding of fabrication processes and product development methodologies
Work with a team of engineers and technicians to complete assigned project
Document and present project methods and results.
3rd year of university completed.
Actively Pursuing Bachelor's or Master's Degree in Material Science, Engineering (ChE, EE, Microelectronics, Microsystems), or Physical Sciences (Chemistry, Physics) with a research topic related to silicon or MEMS processing.
Ability to work and interact effectively with team members from other disciplines, cultures, organizations and other companies both locally and remotely.
Understanding of the fundamental physical and chemical mechanisms of wafer or MEMS processes.
Strong written and spoken communication skills.
Demonstrated leadership, teamwork/interpersonal, communication and technical skills.
Ability to creatively solve problems in a fast-paced product development environment
Understanding of CMOS and/or MEMS fabrication methods.
Experience with semiconductor assembly processes including molding, wirebonding, and adhesive dispense.
Engineering experience working within wafer fab environment
Demonstrated leadership experience.
JMP or other data analysis or statistical software.
Semiconductor circuit design and characterization
Excellent interpersonal and communication skills.