Key Responsibilities include following but not limited to:
Position is in Memory and Materials group of APTD, with focus on 3D NAND and emerging non-volatile memory materials and process development.
Responsible for process integration to develop next generation of memory devices.
Also involves working closely with hardware/process engineering (DT team) to develop new chemistry/hardware to improve electrical performance/yield of test chips.
Additional characterizing/verifying newly developed process using internal test chip results.
Provide the expert level support to AMAT various BUs for developing a solution to customer HVPs in the area of NVMs specially 3D NAND
Need to provide guidance for process development to various process modules such etch, photo, MP, etc on regular basis
Follow through/provide integration support for eTest lots processed in the AMAT cleanroom.
Ph. D. or Master's Degree in Materials Science, Physics or Electrical Engineering/Micro-electronics
Strong background and 5+ years' experience in NAND process development and process integration. Yield enhancement knowledge will be a plus
Solid understanding of unit processes such as Photo, Etch, CMP, Ion Implant, ALD, CVD etc.
Strong understanding of device physics and solid background of electrical tests of NAND is needed
Years of Experience:
4 - 7 Years
Yes, 10% of the Time
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