This positions is within our Engineered Optics team.
Die Singulation Process by laser dicing tool.
Die package assembly.
Drive innovative techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for a range of programs, within safety guidelines.
Design, collect data, analyze and compile reports on significantly complex process engineering experiments for a range of products, within safety guidelines
Design and implement new technology, products and analytical instrumentation
Train engineers, define and implement new methodologies, define and apply new technologies, and/or troubleshoot and resolve significantly complex process engineering issues/problems for a range of products
Develop, plan and execute process engineering projects for a range of products
Interact with key customers to resolve significantly complex process engineering issues for a range of products to address our customers High Value Problems (HVP)
Generate internal and external documentation for products, presentations, technical reports for integrated products and generate process engineering specifications for integrated products
Define and validate film measurement techniques. Train engineers on the techniques and guide them in the interpretation of the data
Regarded as the technical expert in laser dicing/die singulation field
Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function
Years of Experience:
10 - 15 Years
Yes, 20% of the Time
Applied Materials is committed to diversity in its workforce including Equal Employment Opportunity for Minorities, Females, Protected Veterans and Individuals with Disabilities.