About the Position:
Juniper Networks is seeking a highly motivated, creative thinking, self-driven Printed Circuit Board Technologist to work with the latest materials, state of the art manufacturing processes, and supply base ecosystem to develop solutions for next generation products with respect to printed circuit board technology and materials.
PCB Technologist is responsible for maintaining and evolving the PCB Technology and Materials roadmap and ensure it aligns with the product development roadmap for next generation speeds and requirements.
PCB Technologist is responsible for guiding the NPI Hardware teams by documenting, updating and controlling design rules with respect to Materials, Keep outs, Stack up, Routing, and Manufacturing Limitations.
PCB Technologist is responsible to define and implement robust predictive simulation tools in hardware design that will evaluate current density, SI, thermal characteristics, among other parameters to ensure the highest quality, reliability and safety in pcb design.
Assist and execute the Research & Development of new PCB Technologies, Interconnect Structures, and Materials required for new Products, Product performance improvements, and cost reductions prior to the time of needed by Engineering.
Provide PCB and packaging technology support to the Hardware, Signal Integrity, and OPS Teams.
Develop relationships with the PCB Supply Base and Material Laminate Suppliers.
Coordinate and align efforts with PCB Supply Base such that they are capable and ready to meet the PCB Roadmap requirements and qualify suppliers with new technologies and materials.
BS/MS Chemistry or Materials Engineering with 10+ years in PCB Design, PCB fabrication, PCB materials Industry.
Expertise in manufacturing quality including: statistical process control, design of experiments, and quality management.
Expertise in interconnect technology and interconnect reliability in large, Enterprise grade computing center equipment.
Expertise in statistical data analysis, failure analysis and root cause corrective action of large, Enterprise grade computing center equipment.
Expertise in the "Physics of Failure", i.e., the basic fundamental understanding of the physics behind why parts in complex system fail.
Proven expertise in HDI, high layer count PCBs, materials, and signal Integrity challenges with high speed (>>25 Gbps) signal designs.
Extensive expertise in all PCB Technologies with a strong background in the Research and Development of laminate materials, PCB interconnect structures, related Chemistries, and fabrication processes.
Proficiency with the use of CAD Engineering tools such as Cadence, Allegro, Valor, etc.
The ability to effectively work and communicate with various Hardware and Signal Integrity Engineering teams both domestic and offshore, and establish very close and respected relationships with these teams.
Note: If they do not possess these, they still will be considered as meeting the basic requirements of position>
Relocation is not available for this position
Domestic and international travel as required (~15%)