Principal Packaging & Process Engineer

In your new role you will:

• Proactively participate in the new product roadmap definitions and cross-examine the development process in order to meet our stretched targets for new product releases, while ensuring manufacture and profitable next generation products in Operations

• Lead the strategy for long-term process roadmaps and develop new technologies needed for new and next generation products

• Collaborate with other R&D functions, Project Management, Operations, and other stakeholders as the focal person to lead the innovation of assembly and mechanical screening processes for New Product Integration(NPI)

• Develop and update the design rules that will ensure manufacturability, including meeting the required process capability and product reliability

• Identify and mitigate project risks related to backend processes and materials, through the translation of DFMEA to PFMEA, and using other methods of risk management

• Resolve development and manufacturing problems with high complexity involving expert networks, through structured problem-solving techniques like 8D and related tools. Exploits deviations as a tool for discoveries that will support continuous improvement

• Drive technical decisions and develop new process technology, including prototype and production tools and equipment for new products

• Lead the TRB (technical review board) meetings and collaborationensuring new product designs are aligned to the core and future coreprocess roadmaps.

• Aside from working with internal manufacturing site, investigate and work with OSATs that will contribute to new product developments. Support supplier quality, purchasing, and other groups to identify andwork with material vendors impacting new products and future of supplychain of the business unit

You are best equipped for this task if you have:

• Bachelor of Science (preferred Master's degree) in engineering, such as mechanical, packaging, chemical, materials, manufacturing, electrical, or electronics engineering

• Minimum 10 years in semiconductor or electronic assembly process and/or package engineering; including hands-on experience package and process development for new products

• Proven ability to define a structured approach in new process research, development, characterization, qualification, and release to production

• Deep technical understanding of material, package, and process relationships, as they contribute to product performance and manufacturing / operation efficiencies

• Strong knowledge in developing and managing on-site and outsourced back end processes, such as die attach, wire bond, package sealing, lead, finish, trim and form, and mechanical assemblies

• Effective team leader and member, ability to collaborate with otherteams and IR-Hi-Rel/Infineon sites for best practice, resource and knowledge sharing, and lead as expert mentoring technicians and new engineers.

• Strong multi-tasking and prioritization skills, and effective indefining and meeting ambitious schedules towards project completion

• Self-starter, fast-learner with experience working in fast-pace and dynamic manufacturing environment

• Emphasizes personal and professional growth, keeps current with technical and business knowledge and skills, maintains a network infield of expertise

• Demonstrated strong verbal and written communication skills

• An advantage to have but not required:

• Proficient in interpretation of mechanical drawings as well as usingCAD software

• Knowledge on military / aerospace industry standards.

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