Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, Asia and Australia. In addition, MACOM offers foundry services that represents a key core competency within our business. The foundry provides access to, and control of our broad range of proprietary technologies in an asset light, cost effective structure.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
Our global organization of skilled engineers is driven every day to solve the world's most demanding wireless and wireline application challenges. We're proud of our more than sixty years' of hands-on experience designing and building analog semiconductor technology across the RF to Light spectrum.
Principal Packaging Engineer
Job Description and Responsibilities:
Support new package design and development by providing direction to application and design engineers for an optimum cost effective packaging solutions:
Working with Design and Product Engineering, establish and verify the reliability testing requirements for new package designs and processes to guarantee reliable products
Perform design reviews to ensure adherence to DFM guidelines
Define assembly process, troubleshoot and support IC packaging defects
Provide supplier benchmarking and tracking data to drive backend technology roadmap
Assist in new product introduction management. Work with Design, Program Management and Material Planning to plan and establish Engineering Build Requirements and
Qualification Build Requirements for new product introductions
Working with the Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes. Work with suppliers and subcontractors to resolve material quality and process issues
Drive back-end process development for improved reliability, DFM, DFT, and short cycle-time with effective in-line controls and SPC
BS/MS/PhD in Materials Science, Chemical/ME plus 15+ years of experience with advanced IC package process development, design and thermal analysis
Experience with SiP (System in a Package) applications using laminate and ceramic based chip carriers
Experience evaluating organic and ceramic based chip carriers and their suitability for semiconductor assembly
Experience in reliability, failure analysis, and quality assurance in advanced package process development, effects of mechanical, environmental and thermal stress, debug, and qualifications
Experience in deep sub-micron and mixed signal IC packaging process and product development including SPC, DOE, FMEA and Failure Analysis
Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification [JEDEC, IPC, EIA, RoHS, WEEE]
Experience with surface mount technology and IPC-A-610
Intimate knowledge of first and second level interconne