Principal Digital Design Engineer - HBM Design

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

We are looking for a HBM Digital Design Engineer. Are you passionate about designing circuits for the next generation of memory that will power groundbreaking AI applications?

You will work in an innovative and dynamic team and will be responsible for designing and analyzing digital circuits for DRAM and interface die. This includes simulating, optimizing, and floor planning circuits. In this position, you will collaborate with Micron's worldwide design and verification teams and support the efforts of multi-functional teams such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively design HBM products that optimize all manufacturing functions and ensure the best performance, power, cost, quality, reliability, time-to-market, and customer satisfaction. The seniority level offered will be based on the combination of experience and education.

In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.

Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.

What's Encouraged Daily:

• Design and develop high-speed interface PHY and its sub-block such as high-speed paths, calibration, training, control, test, loopback, clock domain crossing, etc.

• Drive innovation into the future Memory generation with a dynamic work environment

• Convert Architecture specification to Micro-architecture specification, and implement logic functions in RTL using Verilog/System Verilog.

• Test design using formal verification tools and functional verification environment.

• Active involvement in problem-solving and implementing opportunities for improvement.

• Work with Pre/Post-silicon verification teams to test, debug, and root-cause RTL simulation/Silicon/System failures.

• Pair with Architect, Modeling, Analog, Design Verification, and APR designers to ensure a smooth interface between Digital and Analog circuits, project execution, and integration.

• Proactively collaborate with Standards, CAD, modeling, and verification groups to ensure the design quality.

• Write scripts to automate design tool flows as required to improve efficiency.

• Mentor and coach other design team members on technical issues.

• Maintain technical expertise and provide training.

How To Qualify:

• BSEE or Greater

• 5+ years of relevant job/skill-related experience

• Experience with implementing logic functions in RTL using Verilog/System Verilog

• Experience with creating circuit specifications.

• Good understanding of timing/area/power/complexity tradeoffs on complex designs

• Knowledge of Synthesis, Static Timing & Constraints, Lint & CDC

• Experience in formal verification tools and functional verification.

• Strong problem-solving and analytical skills

• Knowledge of scripting c-shell, python or Perl, TCL

What Sets You Apart:

• Experience in ASIC backend flow with parasitic extraction and timing closure

• Experience in liberty/Verilog model characterization

• Experience with managing/directing a team

• A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds

• Having an innovative approach that is open to improving upon any of our processes or products.

Potential Team Member Locations:

• Folsom, CA

• Atlanta, GA

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$132,000.00 - $242,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

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