Google's custom-designed equipment makes up one of the largest and most powerful computing infrastructures in the world. The Manufacturing Operations team is responsible for providing the manufacturing capability to deliver this state-of-the-art physical infrastructure. As a Manufacturing Engineer, you evaluate the product designs and create the processes, tools and procedures behind Google's powerful search technology. When vendors build parts for our infrastructure, you're right there alongside ensuring manufacturing processes are repeatable and controlled. You collaborate with Commodity Managers and Design Engineers to determine Google's infrastructure needs and product specifications. Your work ensures the various pieces of Google's infrastructure fit together perfectly and keep our systems humming along smoothly for a seamless user experience.
As a Printed Circuit Board Assembly (PCBA) Engineer, you will work from prototype to NPI to commercialization of products. You will connect all Printed Circuit Board Assembly activities and will work with technical cross-functional teams in the development of new products. This position requires a technical aptitude, including an excellent understanding of DfM methodologies, high volume electronics manufacturing processes, printed circuit board technology, component selection, test and inspection methodologies, quality assurance and consumer electronics product development. The role will also require up to 30% international travel as required.
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.
Bachelor's degree in Electrical, Industrial or Manufacturing Engineering or equivalent practical experience.
10 years of experience with consumer or communication products in PCBA manufacturing and hands-on process experience.
Experience in rework processes, including rework with underfills.
Experience in component footprint design rules and miniaturization.
Master's degree in Electrical, Industrial or Manufacturing Engineering or equivalent practical experience.
Advanced materials experience with underfills, thermal interface materials, RF shielding.
Experience using tools such as Valor and Allegro, and experience with Hardware Reliability Testing.
Knowledge of typical PCBA and product-level failure modes and ability to relate failure modes to process, material and design-related stressors.
Familiarity with surface mount assembly of flexible circuits, including best practices for material.
Technologist with a high level of creativity and curiosity about materials science and electronics packaging at all levels.
Perform Design for Manufacturability (DfM) analysis and deliver scalable manufacturing solutions for PCBAs.
Support NPI builds from concept to product launch, including build preparation, build reports and issue resolution at contract manufacturers.
Support released products until EOL, overseeing process yield control and cost reduction activities.
Identify and drive DfM and process improvements that reduce process cycle times and cost, while maintaining exceptional quality.
Develop new processes to achieve miniaturization.