Lead CMP Engineer

Primary Duties & Responsibilities

Drive development of Silicon Carbide (SiC) substrate fabrication and polishing efforts with a focus on improving quality, throughput and reducing costs. Serve as subject matter expert for wafer polishing, initiate and lead development activities, collaborate with other team members to understand parameters that influence wafer characteristics and improve wafer quality.

Investigate and model experimental data related to SiC substrate fabrication and polishing to establish correlations and trends. Find innovative solutions to technical problems leading to improved product quality, yields and throughput, and achieving high reliability of the equipment and processes used in SiC substrate fabrication and polishing. Actively participate in exploring new technologies and vendor trials. Works with extended team to establish production ready processes.

Contributes to the generation of scientific concepts and milestones for R&D programs. Participates in proposal writing. Writes sections for technical reports, as assigned by General and Program Managers.

Generates scientific and technical ideas and contributes to the Intellectual Property of II-VI by writing IP disclosures and patent applications.

Education & Experience

• Masters/Ph.D. in Mechanical Engineering, Materials Science, Chemistry, Physics or related discipline; Bachelor's degree candidates with equivalent experience will also be considered

• Experience in high volume crystal fabrication and polishing, preferably, in semiconductor substrate fabrication and polishing

• Experience in polishing of GaAs, InP, Si, SiC, or other semiconductor materials is preferred

• Hands-on experience with semiconductor wafer polishing process development, tools and metrology

• Experience with technology transfer from R&D to volume manufacturing

• Experience with problem analysis and resolution related to both processes and equipment.

• Experience in process characterization and optimization and using statistical tools for process analysis

• Excellent interpersonal and communication skills (written and verbal)

Skills

• Design of experiments methodology for process development, statistical software tools for data analysis

• Ability to manage projects involving procurement, installation and prove-in of fabrication and polishing equipment

• Ability to handle multiple priorities involving external and internal priorities

• Ability to work with cross-functional teams and excel in a growing cross-organizational, cross cultural, global team environment

• Ability to work with vendors and evaluate technology

• Handle special assignments promptly and professionally

• Set a high standard of ethics, professionalism, leadership, and competency

Working Conditions

On-site in Easton with some travel

Safety Requirements

All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.

Quality and Environmental Responsibilities

Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

Culture Commitment

Ensure adherence to company's values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity

• Create an Environment of Trust

Collaboration

• Innovate Through the Sharing of Ideas

Accountability

• Own the Process and the Outcome

Respect

• Recognize the Value in Everyone

Enthusiasm

• Find a Sense of Purpose in Work

Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com.