Job Id N1971348 Job Title IC Package CAD Designer / Mgr Post Date 04/11/2019 Company Qualcomm Technologies, Inc.
Job Area Engineering
Job Overview The Qualcomm IC Package Design team is looking to hire a CAD designer / manager in San Diego. This individual will lead the CAD design of advanced package and module designs utilizing both PCB and package substrate technologies.
In addition to hands on CAD design work, the position will be a supervisor/manager role for both internal CAD resources and supplier contract resources. Job responsibilities: Assists engineers in the design and development of complex and detailed layouts of printed circuit boards and packages.
Collaborates in developing state-of-the-art designs of new or modified, high density, printed circuit boards. Establishes design standards and configurations. Works from preliminary schematics, part lists and basic description of the board/package function, configuration and arrangement as defined by engineering.
Responsible for converting circuit design schematic created by hardware design teams to their physical design. Works closely with design engineers and ensures that the layout conforms to all design requirements and is in accordance to guidelines for performance and manufacturability. Makes sure that the generated layout passes all the verification steps including design rule checking (DRC), layout versus schematic (LVS), design for manufacturing (DFM), and electrical rule checking (ERC). All Qualcomm employees are expected to actively support diversity on their teams, and in the Company. Minimum Qualifications Hands on experience in high speed board design including processors, DDR, eMMC, Display, MIPI, DSI, CSI, HDMI interface, PCI express.
" id="hdnMinimumQualifications" /> 7-10 years PCB/package layout design in Mentor/Cadence CAD software
Hands on experience in high speed board design including processors, DDR, eMMC, Display, MIPI, DSI, CSI, HDMI interface, PCI express.
Preferred Qualifications Knowledge of transmission lines, cross talk, decoupling, low-power supply design, and layout of high performance PCBs. Strong signal integrity and PDN Analysis experience are desired.Experience managing off-site CAD design teams Education Requirements High School graduate, college preferred but not required. Keywords Package Design, Cadence SIP, Mentor, Valor, DFM, Integration, IC Packaging, PCB Design, PWB Design