Focal Plane Array Packaging Engineer

Description:

• Provide technical leadership in backend processing, including flip-chip hybridization, lap and polish, AR coating, wire-bonding and epoxy die attach/bonding. • Develop and improve processes focusing on process yield, capability, and throughput. • Apply knowledge of packaging, semiconductor processing, and device physics to enhance FPA development and innovation. • Uphold stringent cleanroom manufacturing standards, emphasizing safety, quality, and workflow efficiency. • Collaborate effectively with cross-functional teams, demonstrating project management skills to drive FPA packaging development projects from concept to completion. • Maintain rigorous documentation and adhere to industry protocols, ensuring consistent quality and compliance. • Lead and mentor team members, promoting a results-driven culture of continuous improvement.

Skills:

packaging engineering, packaging design, semiconductor manufacturing, mechanical, packaging

Top Skills Details:

packaging engineering,packaging design,semiconductor manufacturing,mechanical,packaging

Additional Skills & Qualifications:

• BS or MS in Physics, Material Science, Electrical Engineering, Mechanical Engineering, Industrial Engineering or related fields with a minimum of 3-5+ years • Expertise in semiconductor packaging, including wire bonding and epoxy die attach/bonding. • Experience with specialty equipment qualification and calibration; ability to troubleshoot specialty equipment and custom tooling (in coordination with Equipment Engineering). • Strong excel and data analysis skills; familiarity with data analysis software packages such as JMP is preferred. • Knowledge of statistical process control (SPC) and six-sigma practices. • Experience working hands-on in a cleanroom manufacturing environment. • Proven ability to work in a team-oriented, fast-paced environment, managing multiple priorities and projects with efficiency and reliability. • Strong analytical skills, detail-oriented, with a commitment to quality and safety • Proficiency with Microsoft 365 applications, including Excel, Word, and Outlook. Preferred Skills • Background in IR FPA Packaging, particularly flip-chip hybridization techniques • Setting up electronic test equipment and performing device screening • Knowledge of semiconductor device physics, photodetectors, and FPAs • Background in semiconductor processing • Programming experience, Python in particular

Experience Level:

Intermediate Level

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 30,000 consultants and more than 4,500 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500.

Diversity, Equity & Inclusion

At Actalent, diversity and inclusion are a bridge towards the equity and success of our people. DE&I are embedded into our culture through:

• Hiring diverse talent

• Maintaining an inclusive environment through persistent self-reflection

• Building a culture of care, engagement, and recognition with clear outcomes

• Ensuring growth opportunities for our people

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.