Embedded Firmware Intern

Who We Are

More than 30 years ago, 3D Systems launched the 3D printing industry and has been leading additive manufacturing innovation ever since. Today, our diverse, global workforce brings innovation, performance, and reliability to every interaction - empowering our customers to create physical products at a digital pace. 3D Systems' solutions address a variety of advanced applications in healthcare and industrial markets such as medical and dental, aerospace & defense, automotive, and durable goods.

What Can You Expect?

We believe that conducting business with integrity, valuing diversity in people and ideas, and being a positive force for action in our company and our communities are vital to our success and the right thing to do. We're looking for innovative thought leaders who share this passion to join our Intern Program.

Our summer intern experience is designed to provide students with a challenging and meaningful internship to gain valuable hands-on experience. All students in the program will be given a project with clear learning objectives and desired outcomes. At the conclusion of the internship, each intern will have the opportunity to present their summer project to leadership. Interns will also have exposure to other areas of 3D Systems to learn about all of our solutions. You will be given the opportunity to network with other interns and colleagues at 3D Systems including our senior leaders.

Responsibilities:

• Assist hardware design and software development teams to define and document software functional requirements

• Design, implement, test, and debug software for embedded devices and systems

• Review code and design documentation, provide feedback to team members

• Support the team to deliver products on time and with good quality

• Work in an Agile development environment, using Jira to plan work and track progress

• Support software QA test methodologies

• Interface with cross-functional engineering disciplines (ME, EE, ChemE, Optical, etc) to understand the technology and help determine root cause of system issues

Experience Required:

• Experience with C / C / Python

• Experience with both Windows and/or Linux programming

• Experience in hands-on development and troubleshooting on embedded targets

• Understanding of the Agile development methodologies

• Ability to demonstrate proficiency using modern software development processes, including software source control, configuration management tools, defect tracking tools, and peer review

• Understanding of real-time embedded software development methodologies.

• Experience with, or interest in 3D printing technologies desired

• Strong communication, interpersonal, and leadership abilities

• Detail oriented and possess a strong desire to learn

• Have an outstanding record in their discipline, creativity, productivity, and problem-solving skills

Qualifications for the Intern Program:

• Ability to work 40 hours per week in the specified location from June to August. A housing stipend can be provided only in unique circumstances

• Currently enrolled as a student seeking an Undergraduate or Master's degree

• Preference is for current students who are rising seniors in an undergraduate program or final year students in a graduate program from an accredited school and program.

• Preference is given to students with internship/co-op/research experience

• Applicants must be legally authorized for employment in the United States without need for current or future employer-sponsored work authorization